PCB Technology
Advanced PCB series engineered for semiconductor, ATE, medical, and high-frequency applications.
IC Substrate Series
24L FCBGA
- ▪ Layer: 24L 11+2+11
- ▪ Material: MCL-E-705G+ABF GL103
- ▪ Thickness: 1.5mm
- ▪ Size: 60×75mm
- ▪ Copper: 17µm
- ▪ Min Trace/Space: 9/12µm
- ▪ Min Hole: 50µm
- ▪ Finishing: IT+SOP
10L FCCSP
- ▪ Layer: 10L
- ▪ Material: MCL-E-705G+ABF GL102
- ▪ Thickness: 0.24mm
- ▪ Size: 15×15mm
- ▪ Soldermask: SR1
- ▪ Copper: 15µm
- ▪ Min Trace/Space: 15/15µm
- ▪ Finishing: ENEPIG
4L FCCSP ABF
- ▪ Layer: 4L 1+2+1
- ▪ Material: MCL-E-705G or ABF GX92
- ▪ Thickness: 0.2mm
- ▪ Size: 67.19×50.1mm
- ▪ Copper: 17µm
- ▪ Min Trace/Space: 15/15µm
- ▪ Finishing: ENEPIG
Special PCB For MinLED
- ▪ Layer: 8L HDI(2+N+2)
- ▪ Micro vias: L1-L2, L2-L3, L6-L7, L7-L8
- ▪ Buried holes: L2-L7
- ▪ Pad-to-Pad: 2.8mil
- ▪ Pad size: 3.0×3.0mil
- ▪ Finishing: ENEPIG
6L SiP IC Substrate
- ▪ Layer: 6L
- ▪ Material: DS7409-HGB
- ▪ Thickness: 0.5mm
- ▪ Copper: H/H oz
- ▪ Min LW/LS: 0.05/0.04mm
- ▪ Min Drill: 0.07mm
- ▪ Finishing: ENEPIG
12L FCBGA
- ▪ Layer: 12L 5+2+5
- ▪ Material: MCL-E-705G+ABF GZ41
- ▪ Thickness: 1.27mm
- ▪ Size: 50×50mm
- ▪ Copper: 17µm
- ▪ Min Trace/Space: 10/10µm
- ▪ Finishing: IT+SOP
Gallery
Automotive Industry
Networking & Communication
Industrial Electronics
PCBA